GENEVA, March 9 -- HITACHI ENERGY LTD (Brown-Boveri-Strasse 58050 Zurich) filed a patent application (PCT/EP2024/074272) for "POWER SEMICONDUCTOR MODULE, TERMINAL STRUCTURE AND METHOD" on Aug 30, 2024. With publication no. WO/2025/046066, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SANTOLARIA, Lluis (Rosengasse 54600 Olten), TRUESSEL, Dominik (Reussgasse 115620 Bremgarten)

Abstract: The invention relates to a power semiconductor module (1) comprising a module housing (10), a substrate structure (20) with at least o...