INTERNATIONAL PATENT: HI-SPECTRAL, LLC FILES APPLICATION FOR "OPTICAL COMPONENT AND SYSTEM FOR SIMULTANEOUS 3D HYPERSPECTRAL IMAGING"

GENEVA, July 10 -- HI-SPECTRAL, LLC (17788 Haleakala Hwy.Kula, Hawaii 96790) filed a patent application (PCT/US2024/062021) for "OPTICAL COMPONENT AND SYSTEM FOR SIMULTANEOUS 3D HYPERSPECTRAL IMAGING" on Dec 27, 2024. With publication no. WO/2025/144978, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIN, Haosheng (17788 Haleakala Hwy.Kula, Hawaii 96790)

Abstract: A machined image slicer compact spectrograph (MICS) for use with a multispectral light source includes a two-mirror integral field unit and a micro spectrog...