GENEVA, March 31 -- HEXCEL COMPOSITES LIMITED (Ickleton RoadDuxfordCambridge Cambridgeshire CB22 4QB) filed a patent application (PCT/GB2024/052243) for "THERMALLY CURABLE RESIN BLEND AND ITS USE IN COMPOSITE MATERIALS" on Aug 29, 2024. With publication no. WO/2025/062112, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WHITER, Mark (c/o Hexcel Composites LimitedIckleton RoadDuxfordCambridge CB22 4QB)

Abstract: A thermally curable resin blend, comprising a) from 50 to 90 wt% cycloaliphatic curable epoxy resin having an...