INTERNATIONAL PATENT: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. FILES APPLICATION FOR "MOLDED INTEGRATED CIRCUIT DIES"

GENEVA, Dec. 31 -- HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (10300 Energy DriveSpring, Texas 77389) filed a patent application (PCT/US2024/035116) for "MOLDED INTEGRATED CIRCUIT DIES" on Jun 21, 2024. With publication no. WO/2025/264231, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SONG, Bo (1070 NE Circle Blvd.Corvallis, Oregon 97330-4241), CHEN, Chien-Hua (1070 NE Circle Blvd.Corvallis, Oregon 97330-4241), WU, Fan (1070 NE Circle Blvd.Corvallis, Oregon 97330-4241)

Abstract: A method includes providing an integrated...