INTERNATIONAL PATENT: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. FILES APPLICATION FOR "COOLING DEVICE FOR A SYSTEM-ON-CHIP"

GENEVA, July 14 -- HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P. (10300 Energy DriveSpring, Texas 77389) filed a patent application (PCT/US2024/010220) for "COOLING DEVICE FOR A SYSTEM-ON-CHIP" on Jan 03, 2024. With publication no. WO/2025/147241, the details related to the patent application was published on Jul 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Chien-Hua (1070 NE Circle Blvd.Corvallis, Oregon 97330-4241), CUMBIE, Michael W. (1070 NE Circle Blvd.Corvallis, Oregon 97330-4241), GROOM, Michael (1070 NE Circle Blvd.Corvallis, Oregon 97330-4241)

Abstract: A cooling device ...