GENEVA, July 7 -- HESAI TECHNOLOGY CO., LTD. (No.3188, Baoqian HighwayJiading District, Shanghai 201815) filed a patent application (PCT/CN2024/140812) for "LASER, LASER CHIP, AND LIDAR" on Dec 20, 2024. With publication no. WO/2025/140019, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): XUAN, Liyang (No.3188, Baoqian HighwayJiading District, Shanghai 201815), FEI, Jiarui (No.3188, Baoqian HighwayJiading District, Shanghai 201815), XIANG, Shaoqing (No.3188, Baoqian HighwayJiading District, Shanghai 201815)
Abstract:
A ...