GENEVA, Jan. 27 -- HESAI TECHNOLOGY CO., LTD. (No.3188, Baoqian HighwayJiading District, Shanghai 201815) filed a patent application (PCT/CN2024/106349) for "CHIP MODULES AND LIDARS" on Jul 19, 2024. With publication no. WO/2025/016448, the details related to the patent application was published on Jan 23, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YAO, Tingyu (No.3188, Baoqian HighwayJiading District, Shanghai 201815), XIANG, Shaoqing (No.3188, Baoqian HighwayJiading District, Shanghai 201815)
Abstract:
A chip module includes a light-sensitive chip and a signal processing chip. The ...