GENEVA, Dec. 29 -- HESAI TECHNOLOGY CO., LTD. (No. 3188, Baoqian HighwayJiading District, Shanghai 201815), 上海禾赛科技有限公司 (中国上海市嘉定区宝钱公路3188号) filed a patent application (PCT/CN2025/101311) for "SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR DEVICE ARRAY AND LIDAR" on Jun 17, 2025. With publication no. WO/2025/261319, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organizati...