GENEVA, June 4 -- HERAEUS MATERIALS SINGAPORE PTE. LTD. (Block 5014, Ang Mo Kio Avenue 5,#07-01 Techplace IISingapore 569881) filed a patent application (PCT/SG2024/050001) for "TIN-BASED SOLDER ALLOY POWDER" on Jan 02, 2024. With publication no. WO/2025/110921, the details related to the patent application was published on May 30, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): AGALA, Joel (c/o Heraeus Materials Singapore PTE. Ltd.Block 26, #06-11/12, Pioneer CrescentWest Park BizCentralSingapore 628558), ZHUO, JingMei (c/o Heraeus Materials Singapore PTE. Ltd.Block 5002, Ang Mo Kio Avenue ...