GENEVA, Aug. 10 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/050630) for "THERMOCOUPLE" on Jan 13, 2025. With publication no. WO/2025/162698, the details related to the patent application was published on Aug 07, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ROSCHEK, Tobias (Aufderhohe 242699 Solingen), DIEPVENTS, Bart (Oosterwennel 423600 Genk)
Abstract:
The present invention relates to a thermocouple, comprising thermoplastic resin-based silver ink as a first thermocouple element and thermoplastic resin-based carbon ink as a second ...