GENEVA, March 24 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2024/074452) for "PRESSURE SENSITIVE ADHESIVE COMPOSITION" on Sep 02, 2024. With publication no. WO/2025/056352, the details related to the patent application was published on Mar 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KASPER, Dirk (Benrodestr. 6340597 Dusseldorf), LANOVA, Barbora (Am Broichgraben 2440589 Dusseldorf), BRAMMERTZ, Benjamin (Buchenweg 2840699 Erkrath)
Abstract:
The present invention refers to a pressure sensitive adhesive composition, the use of said com...