GENEVA, Aug. 18 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/053354) for "METHOD OF BONDING ELASTOMERIC SUBSTRATES" on Feb 10, 2025. With publication no. WO/2025/168833, the details related to the patent application was published on Aug 14, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SALMOIRAGHI, Eleonora (Via Tiziano 8320018 Sedriano (MI)), CREMONESI, Stefano (Via San't Anna 527010 Siziano - Pavia), SIGNORILE, Marco (Via Togliatti 20/F27010 Vellezzo Bellini)
Abstract:
The present disclosure is directed to a method for forming a bon...