INTERNATIONAL PATENT: HENKEL AG & CO. KGAA FILES APPLICATION FOR "ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM"

GENEVA, Nov. 10 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/060252) for "ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM" on Apr 14, 2025. With publication no. WO/2025/228674, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LAMMERTZ, Janik (Furstenwall 21440215 Dusseldorf), STRICKER, Lucas (StephanienstraBe 3640211 Dusseldorf), STAPF, Stefanie (Zur Grafenburg 57 a42549 Velbert), TADEN, Andreas (Kappeler Strasse 2a40597 Dusseldorf), SIELAFF, Patric (Schwabhausenfeld 5442349 ...