INTERNATIONAL PATENT: HENKEL AG & CO. KGAA FILES APPLICATION FOR "ELECTRICALLY DEBONDABLE SILYL MODIFIED POLYMER-BASED ADHESIVE"

GENEVA, Dec. 22 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/063328) for "ELECTRICALLY DEBONDABLE SILYL MODIFIED POLYMER-BASED ADHESIVE" on May 15, 2025. With publication no. WO/2025/256854, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FLECK, Tom (Benrodestr. 8440589 Dusseldorf), BUGA, Duygu (Nordkanal Allee 4041564 Kaarst)

Abstract: The present invention relates to a debondable silyl modified polymer-based adhesive composition comprising a silyl group terminated po...