GENEVA, Nov. 17 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/062752) for "DEBONDING OF A CURED COMPOSITION" on May 09, 2025. With publication no. WO/2025/233508, the details related to the patent application was published on Nov 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): DEEGAN, Brian (C/O Henkel Ireland Ltd.Tallaght Business ParkWhitestownDublin 24), LOANE, Mark (C/O Henkel Ireland Ltd.Tallaght Business ParkWhitestownDublin 24), SWEENEY, Nigel (C/O Henkel Ireland Ltd.Tallaght Business ParkWhitestownDublin 24)
Abstract: A method ...