INTERNATIONAL PATENT: HENKEL AG & CO. KGAA FILES APPLICATION FOR "BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM"

GENEVA, Nov. 30 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/060909) for "BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM" on Apr 22, 2025. With publication no. WO/2025/242379, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): STRICKER, Lucas (StephanienstraBe 3640211 Dusseldorf), HUEHNERGARTH, Philipp (Am Rubenkamp 347279 Duisburg), STAPF, Stefanie (Zur Grafenburg 57 a42549 Velbert), TAO, FangQi (Building 4, No.150, Gebaini Road, Pudong New Dist...