INTERNATIONAL PATENT: HENKEL AG & CO. KGAA FILES APPLICATION FOR "A THERMALLY DEBONDABLE, NON-REACTIVE HEAT ACTIVATED ADHESIVE COMPOSITION"

GENEVA, Sept. 21 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/054443) for "A THERMALLY DEBONDABLE, NON-REACTIVE HEAT ACTIVATED ADHESIVE COMPOSITION" on Feb 19, 2025. With publication no. WO/2025/190624, the details related to the patent application was published on Sep 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FRANKEN, Uwe (HaselnuBweg 441542 Dormagen), HEIDA, Thomas (EllerstraBe 340721 Hilden), GUTSCHE, Nadine (Am Strauch 2240723 Hilden), BERGMANN, Sophie (Vennfelder Str. 10, 27-10447805 Krefeld)

Abstract: The present inventi...