GENEVA, Aug. 13 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Duesseldorf), TIMMERMAN, John (18930 West 78th StreetChanhassen, Minnesota 55317) filed a patent application (PCT/US2025/014264) for "THERMALLY CONDUCTIVE ADHESIVE COMPOSITIONS" on Feb 03, 2025. With publication no. WO/2025/166327, the details related to the patent application was published on Aug 07, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MURLEY, Nicole A. (18930 West 78th StreetChanhassen, Minnesota 55317)
Abstract:
An epoxy adhesive may be formed from a curable epoxy/amine composition, wherein the epoxy polymerizat...