GENEVA, March 18 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Duesseldorf), SKRZYNIARZ, Sarah (10 Finderne Avenue, Suite BBridgewater, New Jersey 08807) filed a patent application (PCT/US2024/045331) for "LAMINATING ADHESIVE FOR COMPOSTABLE FLEXIBLE PACKAGING" on Sep 05, 2024. With publication no. WO/2025/054283, the details related to the patent application was published on Mar 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KENION, Grant (10 Finderne Avenue, Suite BBridgewater, New Jersey 08807)
Abstract:
Disclosed is a one component, moisture curable, laminating adhesive that pro...