INTERNATIONAL PATENT: HENKEL AG & CO. KGAA, HENKEL ADHESIVE TECHNOLOGIES (SHANGHAI) CO., LTD. FILES APPLICATION FOR "MOISTURE AND HEAT CURABLE COMPOSITION, PREPARATION METHOD AND USE OF THE SAME"

GENEVA, July 28 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Duesseldorf), HENKEL ADHESIVE TECHNOLOGIES (SHANGHAI) CO., LTD. (No. 928 Zhangheng RoadPudong New Area, Shanghai 201203) filed a patent application (PCT/CN2024/072259) for "MOISTURE AND HEAT CURABLE COMPOSITION, PREPARATION METHOD AND USE OF THE SAME" on Jan 15, 2024. With publication no. WO/2025/151977, the details related to the patent application was published on Jul 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): XU, Xuan (Building 4# No. 150 Gebaini Rd.Pudong New Area, Shanghai 201203), SUN, Wenyan (Room 22-202, Lane 881...