GENEVA, Oct. 12 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Duesseldorf), HENKEL ADHESIVE TECHNOLOGIES (SHANGHAI) CO., LTD. (No. 928 Zhangheng RoadPudong New Area, Shanghai 201203) filed a patent application (PCT/CN2024/085867) for "METHOD FOR RECYCLING THERMALLY CONDUCTIVE FILLERS FROM SILICONE ADHESIVE WASTES" on Apr 03, 2024. With publication no. WO/2025/208418, the details related to the patent application was published on Oct 09, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): CHEN, Jianying (No. 928 Zhangheng RoadPudong New Area, Shanghai 201203)
Abstract: The present invention pro...