INTERNATIONAL PATENT: HENKEL AG & CO. KGAA, HENKEL ADHESIVE TECHNOLOGIES (SHANGHAI) CO., LTD. FILES APPLICATION FOR "ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM"

GENEVA, Nov. 30 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Duesseldorf), HENKEL ADHESIVE TECHNOLOGIES (SHANGHAI) CO., LTD. (No. 928 Zhangheng RoadPudong New Area, Shanghai 201203) filed a patent application (PCT/CN2024/094157) for "ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM" on May 20, 2024. With publication no. WO/2025/241055, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): STRICKER, Lucas (Stephanienstrasse 3640211 Duesseldorf), HUEHNERGARTH, Philipp (Allensteiner Ring 5547279 Duisburg), STAPF, Stefanie (Zur Grafenb...