GENEVA, Jan. 11 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Duesseldorf), HENKEL ADHESIVE TECHNOLOGIES (SHANGHAI) CO., LTD. (No. 928 Zhangheng RoadPudong New Area, Shanghai 201203), HENKEL (CHINA) INVESTMENT CO., LTD. (Floor 1, Building 7, No. 99 Jiangwancheng RoadYangpu District, Shanghai 200438), ABLESTIK (SHANGHAI) LTD. (No. 332 Meigui South Road, Waigaoqiao Free Trade ZonePudong New Area, Shanghai 200131) filed a patent application (PCT/CN2024/103552) for "THERMALLY CONDUCTIVE SILICONE COMPOSITION" on Jul 04, 2024. With publication no. WO/2026/007059, the details related to the patent application was published on Jan 08, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, w...