GENEVA, Oct. 17 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Duesseldorf), HENKEL (CHINA) INVESTMENT CO., LTD. (Floor 5, 6, 7, Building 6, No. 99 Jiang Wan Cheng Road, Yangpu DistrictShanghai 200438) filed a patent application (PCT/CN2024/086921) for "HOTMELT PRESSURE SENSITIVE ADHESIVE COMPOSITION" on Apr 10, 2024. With publication no. WO/2025/213374, the details related to the patent application was published on Oct 16, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): WU, Tan (No. 928 Zhangheng Road, Pudong New AreaShanghai 201203)
Abstract: A hotmelt pressure sensitive adhesive composit...