GENEVA, June 29 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Duesseldorf), HENKEL (CHINA) INVESTMENT CO., LTD. (Floor 5, 6, 7, Building 6, No. 99 Jiang Wan Cheng RoadYangpu District, Shanghai 200438), HENKEL ADHESIVE TECHNOLOGIES (SHANGHAI) CO., LTD. (No. 928 Zhangheng RoadPudong New Area, Shanghai 201203) filed a patent application (PCT/CN2023/139699) for "THERMALLY CONDUCTIVE SILICONE POTTING COMPOSITIONS, AND ARTICLES AND ASSEMBLIES THEREFROM" on Dec 19, 2023. With publication no. WO/2025/129422, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organiz...