INTERNATIONAL PATENT: HENKEL AG & CO. KGAA, HENKEL (CHINA) CO., LTD., HENKEL (CHINA) INVESTMENT CO., LTD. FILES APPLICATION FOR "BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM"

GENEVA, Nov. 30 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Duesseldorf), HENKEL (CHINA) CO., LTD. (No. 189 Guo Yuan Road, Zhu Qiao TownPudong New Area, Shanghai 201325), HENKEL (CHINA) INVESTMENT CO., LTD. (Floor 1, Building 7, No. 99 Jiangwancheng RoadYangpu District, Shanghai 200438) filed a patent application (PCT/CN2024/094168) for "BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM" on May 20, 2024. With publication no. WO/2025/241057, the details related to the patent application was published on Nov 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): STRICKE...