INTERNATIONAL PATENT: HELIATEK GMBH FILES APPLICATION FOR "ORGANIC ELECTRONIC COMPONENT COMPRISING A CONVERSION CONTACT LOCATED BETWEEN TWO PHOTOACTIVE LAYERS"

GENEVA, Feb. 3 -- HELIATEK GMBH (Treidlerstr. 301139 Dresden) filed a patent application (PCT/DE2024/100668) for "ORGANIC ELECTRONIC COMPONENT COMPRISING A CONVERSION CONTACT LOCATED BETWEEN TWO PHOTOACTIVE LAYERS" on Jul 26, 2024. With publication no. WO/2025/021264, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PFEIFFER-JACOB, Martin (Heliatek GmbHTreidlerstr. 301139 Dresden), UHRICH, Christian (Heliatek GmbHTreidlerstr. 301139 Dresden), BIRNSTOCK, Jan (Heliatek GmbHTreidlerstr. 301139 Dresden)

Abstract: The invent...