GENEVA, May 12 -- HD MICROSYSTEMS, LTD. (1-6, Shinjuku 4-chome, Shinjuku-ku, Tokyo1600022), ＨＤマイクロシステムズ株式会社 (東京都新宿区新宿四丁目１番６号) filed a patent application (PCT/JP2023/039753) for "RESIN COMPOSITION, CURED ARTICLE, METHOD FOR PRODUCING CURED ARTICLE, AND ELECTRONIC COMPONENT" on Nov 02, 2023. With publication no. WO/2025/094400, the details related to the patent application was published on May 08, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Worl...