INTERNATIONAL PATENT: HARMAN INTERNATIONAL INDUSTRIES,INCORPORATED, LIU, SANKUN FILES APPLICATION FOR "METHOD FOR FIT ASSESSMENT OF WEARABLE DEVICE, ELECTRONIC DEVICE AND STORAGE MEDIUM"

GENEVA, Oct. 3 -- HARMAN INTERNATIONAL INDUSTRIES , INCORPORATED (400 Atlantic Street, StamfordConnecticut), LIU, Sankun (20F, China Merchants Port Plaza, No. 1, Gongye 3rd Road, Shekou, Nanshan DistrictShenzhen, Guangdong 518067) filed a patent application (PCT/CN2024/084812) for "METHOD FOR FIT ASSESSMENT OF WEARABLE DEVICE, ELECTRONIC DEVICE AND STORAGE MEDIUM" on Mar 29, 2024. With publication no. WO/2025/199949, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Jeoung Min (20F, China Merchants Port Plaza, No. 1, G...