INTERNATIONAL PATENT: HARMAN INTERNATIONAL INDUSTRIES,INCORPORATED, LI, SHANGPENG FILES APPLICATION FOR "ASK MODULATION COMMUNICATION FOR DSP AUDIO AMPLIFIER AND SPEAKER ASSEMBLY"

GENEVA, Dec. 7 -- HARMAN INTERNATIONAL INDUSTRIES , INCORPORATED (400 Atlantic Street, StamfordConnecticut), LI, Shangpeng (125 Fangzhou Road, Suzhou Industrial ParkSuzhou, Jiangsu 215024) filed a patent application (PCT/CN2024/096726) for "ASK MODULATION COMMUNICATION FOR DSP AUDIO AMPLIFIER AND SPEAKER ASSEMBLY" on May 31, 2024. With publication no. WO/2025/245852, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HARMAN INTERNATIONAL INDUSTRIES , INCORPORATED (400 Atlantic Street, StamfordConnecticut), LI, Shangpeng (125...