INTERNATIONAL PATENT: HARMAN INTERNATIONAL INDUSTRIES,INCORPORATED, CHEN, ZHI FILES APPLICATION FOR "METHOD FOR MONITORING CONTACT IMPEDANCE STATUS OF ELECTRONIC DEVICE"

GENEVA, June 9 -- HARMAN INTERNATIONAL INDUSTRIES , INCORPORATED (400 Atlantic Street, StamfordConnecticut), CHEN, Zhi (Harman Technology (Shenzhen) Ltd., 20F, China Merchants Port Plaza, No. 1, Gongye 3rd Road, Shekou, NanshanShenzhen, Guangdong 518067) filed a patent application (PCT/CN2023/135792) for "METHOD FOR MONITORING CONTACT IMPEDANCE STATUS OF ELECTRONIC DEVICE" on Dec 01, 2023. With publication no. WO/2025/112028, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHANG, Yi (Harman Technology (Shenzhen) Ltd., 20F...