INTERNATIONAL PATENT: HANWHA SOLUTIONS CORPORATION, 한화솔루션 주식회사 FILES APPLICATION FOR "SOLDERING DEVICE AND METHOD"

GENEVA, Feb. 4 -- HANWHA SOLUTIONS CORPORATION (86 Cheonggyecheon-ro,Jung-gu,Seoul 04541), 한화솔루션 주식회사 (서울특별시중구청계천로 86) filed a patent application (PCT/KR2024/007560) for "SOLDERING DEVICE AND METHOD" on Jun 03, 2024. With publication no. WO/2025/023478, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Hyeonseung (86 Cheonggyecheon-ro,Jung-gu,Seoul 04541), 이현승 ...