GENEVA, Feb. 1 -- HACINT INTELLIGENCE TECHNOLOGY CO., LTD (No. 396, Bohai Road, Economic and Technological Development ZoneHebi, Henan 458030), 鹤壁海昌智能科技股份有限公司 (中国河南省鹤壁市经济技术开发区渤海路396号) filed a patent application (PCT/CN2025/083204) for "WIRE BUNDLING MODULE AND WIRE BUNDLING PROCESSING DEVICE" on Mar 18, 2025. With publication no. WO/2026/020849, the details related to the patent application was published on Jan 29, 2026.
Notably, the patent application was submitted under the International Patent Classification (...