INTERNATIONAL PATENT: GREENE LYON GROUP, INC. FILES APPLICATION FOR "RECOVERY OF SOLDER WHEN COMPONENTS ARE REMOVED FROM POPULATED CIRCUIT BOARDS USING A LIQUID HEAT MEDIUM"

GENEVA, Nov. 5 -- GREENE LYON GROUP, INC. (100 Cummings Center, Suite 207PBeverly, MA 01915) filed a patent application (PCT/US2025/025348) for "RECOVERY OF SOLDER WHEN COMPONENTS ARE REMOVED FROM POPULATED CIRCUIT BOARDS USING A LIQUID HEAT MEDIUM" on Apr 18, 2025. With publication no. WO/2025/226531, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HALE, Karl (18 Cider Mill RoadBerlin, CT 06037)

Abstract: Systems and methods for the removal of electronic chips and other components from PWBs using liquid heat media are g...