INTERNATIONAL PATENT: GOOGLE LLC FILES APPLICATION FOR "REDISTRIBUTION LAYER (RDL) FANOUT PACKAGE DESIGN & CHIPLET DIE-TO-DIE INTERCONNECT ROUTING"

GENEVA, Aug. 6 -- GOOGLE LLC (1600 Amphitheatre ParkwayMountain View, California 94043) filed a patent application (PCT/US2025/012705) for "REDISTRIBUTION LAYER (RDL) FANOUT PACKAGE DESIGN & CHIPLET DIE-TO-DIE INTERCONNECT ROUTING" on Jan 23, 2025. With publication no. WO/2025/160246, the details related to the patent application was published on Jul 31, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WENG, Li-Sheng (1600 Amphitheatre ParkwayMountain View, California 94043), HE, Biao (1600 Amphitheatre ParkwayMountain View, California 94043), SHAH, Milind (1600 Amphitheatre ParkwayMountain V...