INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD. FILES APPLICATION FOR "SYSTEMS AND METHODS FOR COOLING A CHUNK POLYCRYSTALLINE FEEDER"

GENEVA, Nov. 25 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075) filed a patent application (PCT/US2024/030261) for "SYSTEMS AND METHODS FOR COOLING A CHUNK POLYCRYSTALLINE FEEDER" on May 20, 2024. With publication no. WO/2025/239906, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LUTER, William Lynn (501 Pearl DriveSt. Peters, Missouri 63376), RYU, JaeWoo (501 Pearl DriveSt. Peters, Missouri 63376), PARK, SeongSu (c/o GlobalWafers (MKC)854, Manghyang-ro, Seonggeo-...