INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD. FILES APPLICATION FOR "SYSTEMS AND METHODS FOR ANALYZING NANOTOPOGRAPHY OF FRONT-END PROCESSED SEMICONDUCTOR WAFERS"

GENEVA, Jan. 20 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial Park30075 Hsinchu City) filed a patent application (PCT/US2025/036902) for "SYSTEMS AND METHODS FOR ANALYZING NANOTOPOGRAPHY OF FRONT-END PROCESSED SEMICONDUCTOR WAFERS" on Jul 09, 2025. With publication no. WO/2026/015590, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHU, Yung Hsing (c/o GlobalWafers Co., Ltd.No. 2 Creation Road 1Science-Based Industrial ParkHsinchu City, 30075), YANG, Yau-Ching (c/o GlobalWafers Co., Ltd....