INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD. FILES APPLICATION FOR "SYSTEM AND METHOD FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS"

GENEVA, Feb. 4 -- GLOBALWAFERS CO., LTD. (No. 8, Gongye E. 2nd Rd., East DistrictHsinchu City, 30075) filed a patent application (PCT/US2023/086028) for "SYSTEM AND METHOD FOR CONTROLLING WAFER BREAKAGE DURING INGOT SLICING OPERATIONS" on Dec 27, 2023. With publication no. WO/2025/024004, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIAO, Jung-Chiang (No. 2, Creation Road 1Hsinchu Science ParkHsinchu, 30077), CHOU, Yi-Chun (No. 2, Creation Road 1Hsinchu Science ParkHsinchu, 30077), CHEN, Liang-Chin (No. 2, Creation Roa...