GENEVA, May 19 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075) filed a patent application (PCT/US2024/054824) for "SYSTEM AND METHOD FOR BOND TREATING AND CLEAVING OF SILICON WAFERS" on Nov 07, 2024. With publication no. WO/2025/101678, the details related to the patent application was published on May 15, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): OGLE, Michael (501 Pearl DriveSt. Peters, Missouri 63376), ALBRECHT, Peter (501 Pearl DriveSt. Peters, Missouri 63376), LIU, Qingmin (501 Pearl DriveSt. Peters, Missouri 63376), LUTER,...