GENEVA, Feb. 11 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial Park30075 Hsinchu City) filed a patent application (PCT/US2025/039024) for "METHODS FOR FINISH POLISHING SEMICONDUCTOR SUBSTRATES WITH ETHYLENEDIAMINE" on Jul 24, 2025. With publication no. WO/2026/030099, the details related to the patent application was published on Feb 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): HSU, Chih Yuan (c/o GlobalWafers Co., Ltd.No. 2 Creation Road 1Science-Based Industrial ParkHsinchu City, 30075), LEE, Meng-Hung (c/o GlobalWafers Co., Ltd.No. 2 Creation Road ...