INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD. FILES APPLICATION FOR "ETCHING APPARATUS THAT OSCILLATE WAFERS DURING ETCHING"

GENEVA, Jan. 20 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075) filed a patent application (PCT/US2025/036493) for "ETCHING APPARATUS THAT OSCILLATE WAFERS DURING ETCHING" on Jul 03, 2025. With publication no. WO/2026/015399, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HU, Chieh (c/o GlobalWafers Co., Ltd.No. 2, Creation Road 1Science-Based Industrial ParkHsinchu City, 30077), CHIANG, Tzu-Tsen (c/o GlobalWafers Co., Ltd.No. 2, Creation Road 1Science-Based Indus...