INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD. FILES APPLICATION FOR "DOUBLE-SIDE GRINDING APPARATUS AND METHODS HAVING A WHEELBASE WITH POROUS ABRASIVE MEMBERS"

GENEVA, Jan. 20 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial Park30075 Hsinchu City) filed a patent application (PCT/US2025/036998) for "DOUBLE-SIDE GRINDING APPARATUS AND METHODS HAVING A WHEELBASE WITH POROUS ABRASIVE MEMBERS" on Jul 09, 2025. With publication no. WO/2026/015651, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHOI, Cheulwon (c/o MEMC Korea Company Ltd.854, Manghyang-ro, Seonggeo-eup, Seobuk-guCheonan-siChungcheongnam-do 31043), LEE, Jaehoon (c/o MEMC Korea Company Lt...