INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD., MEYER, BENJAMIN MICHAEL FILES APPLICATION FOR "MODULAR DOPING SEED FOR DOPING MELT OF SEMICONDUCTOR MATERIAL"

GENEVA, Jan. 27 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075), MEYER, Benjamin Michael (c/o MEMC LLC501 Pearl DriveSt. Peters, Missouri 63376) filed a patent application (PCT/US2025/037850) for "MODULAR DOPING SEED FOR DOPING MELT OF SEMICONDUCTOR MATERIAL" on Jul 16, 2025. With publication no. WO/2026/019883, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075), MEY...