INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD., LIU, QINGMIN FILES APPLICATION FOR "FDSOI STRUCTURES AND METHODS FOR PREPARING FDSOI STRUCTURES"

GENEVA, Jan. 27 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075), LIU, Qingmin (c/o Memc LLC501 Pearl DriveSt. Peters, Missouri 63376) filed a patent application (PCT/US2025/037891) for "FDSOI STRUCTURES AND METHODS FOR PREPARING FDSOI STRUCTURES" on Jul 16, 2025. With publication no. WO/2026/019906, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075), LIU, Qingmin (c/...