INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD., BHAGAVAT, SUMEET S. FILES APPLICATION FOR "CLEAVING SYSTEMS AND METHODS FOR CLEAVING SEMICONDUCTOR STRUCTURES BY COMBINED THERMAL AND MECHANICAL STRESS INDUCTION"

GENEVA, Jan. 27 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075), BHAGAVAT, Sumeet S. (c/o MEMC LLC501 Pearl DriveSt. Peters, Missouri 63376) filed a patent application (PCT/US2025/037820) for "CLEAVING SYSTEMS AND METHODS FOR CLEAVING SEMICONDUCTOR STRUCTURES BY COMBINED THERMAL AND MECHANICAL STRESS INDUCTION" on Jul 16, 2025. With publication no. WO/2026/019866, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LUTER, William L. (c/o MEMC LLC501 Pearl DriveSt. Pete...