INTERNATIONAL PATENT: GIESECKE+DEVRIENT MOBILE SECURITY GERMANY GMBH FILES APPLICATION FOR "METHOD FOR TRANSMITTING PROFILES TO A CHIP MODULE AND FOR OPERATING THE CHIP MODULE, CHIP MODULE AND DEVICE COMPRISING SUCH A CHIP MODULE"

GENEVA, May 11 -- GIESECKE+DEVRIENT MOBILE SECURITY GERMANY GMBH (Prinzregentenstr. 16181677 Munchen) filed a patent application (PCT/DE2024/100836) for "METHOD FOR TRANSMITTING PROFILES TO A CHIP MODULE AND FOR OPERATING THE CHIP MODULE, CHIP MODULE, AND DEVICE COMPRISING SUCH A CHIP MODULE" on Sep 23, 2024. With publication no. WO/2025/093075, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUBER, Ulrich (Walliser Str. 10681475 Munchen)

Abstract: The invention relates to: a method for transmitting profiles to a chip ...