INTERNATIONAL PATENT: GIESECKE+DEVRIENT MOBILE SECURITY GERMANY GMBH FILES APPLICATION FOR "METHOD FOR CONFIGURING A CHIP MODULE WITH A PROFILE, CHIP MODULE AND DEVICE COMPRISING SUCH A CHIP MODULE"

GENEVA, June 9 -- GIESECKE+DEVRIENT MOBILE SECURITY GERMANY GMBH (Prinzregentenstr. 16181677 Munchen) filed a patent application (PCT/DE2024/100957) for "METHOD FOR CONFIGURING A CHIP MODULE WITH A PROFILE, CHIP MODULE, AND DEVICE COMPRISING SUCH A CHIP MODULE" on Nov 12, 2024. With publication no. WO/2025/113731, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUBER, Ulrich (Giesecke+Devrient Mobile Security Germany GmbHPrinzregentenstr. 16181677 Munchen)

Abstract: The invention relates to a method (200) for configuri...