INTERNATIONAL PATENT: GELEST, INC. FILES APPLICATION FOR "LOW TEMPERATURE THERMAL DEPOSITION OF SILICON-CONTAINING FILMS USING LOW WATER CONTENT HYDROGEN PEROXIDE"

GENEVA, Oct. 6 -- GELEST, INC. (11 E. Steel RoadMorrisville, PA 19067) filed a patent application (PCT/US2025/021098) for "LOW TEMPERATURE THERMAL DEPOSITION OF SILICON-CONTAINING FILMS USING LOW WATER CONTENT HYDROGEN PEROXIDE" on Mar 24, 2025. With publication no. WO/2025/207487, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BRICK, Chad, Michael (19 Wilfred DriveYardley, PA 19067), OGATA, Tomoyuki (c/o Mitsubishi Chemical Corporation1-1, Marunouchi 1-chome, Chiyoda-kuTokyo, 100-8251)

Abstract: Provided are methods fo...