INTERNATIONAL PATENT: FUTUREWEI TECHNOLOGIES, INC. FILES APPLICATION FOR "POLYMER LAYER STACK AND METHODS OF FORMING THEREOF"

GENEVA, March 26 -- FUTUREWEI TECHNOLOGIES, INC. (15851 Dallas Parkway,Suite 650Addison, Texas 75001) filed a patent application (PCT/US2024/058694) for "POLYMER LAYER STACK AND METHODS OF FORMING THEREOF" on Dec 05, 2024. With publication no. WO/2025/059696, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LI, Wen (5540 S Woodlawn Ave.Chicago, Illinois 60637), CAO, Yue (34166 Duke Ln.Fremont, California 94555), LI, Zhuo (1 Richmond St., Apt 2043New Brunswick, New Jersey 08901), HAN, Jiale (1041 Summerview Dr.San Jose, Cal...