INTERNATIONAL PATENT: FUTUREWEI TECHNOLOGIES, INC. FILES APPLICATION FOR "DISTRIBUTED CIRCUIT DESIGN USING SINGLE STEP REINFORCEMENT LEARNING"

GENEVA, May 28 -- FUTUREWEI TECHNOLOGIES, INC. (15851 Dallas Parkway, Suite 650Addison, Texas 75001) filed a patent application (PCT/US2024/055560) for "DISTRIBUTED CIRCUIT DESIGN USING SINGLE STEP REINFORCEMENT LEARNING" on Nov 12, 2024. With publication no. WO/2025/106444, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MORTAZAVI, Masood (15851 Dallas Parkway, Suite 650Addison, Texas 75001), LI, Jiayu (15851 Dallas Parkway, Suite 650Addison, Texas 75001), YAN, Ning (15851 Dallas Parkway, Suite 650Addison, Texas 75001) ...